Card and Profile Compliance Test Benches for Unsoldered M2M eUICCs
To make sure that M2M devices in the field do not fail, it is very important to test the UICC extensively before it is soldered. On our Connectivity Test Center, we offer several test benches which help you to prove profile interoperability according SIMalliance specification as well as GlobalPlatform card compliancy.
Figure 1: Test setup for M2M eUICC card compliance testing
The part of the GSMA SGP.11 focusing on testing SM-DP and SM-SR interfaces (off-card interfaces) we offer in a separate test bench:
Figure 2: Test setup for M2M off card interface compliance testing
Interoperability Testing and Customer Specific Testing of M2M eUICCs
eUICC soldered into the M2M device
A soldered M2M eUICC can only be accessed indirectly from the back-end side using the mobile network interface. COMPRION's approach to gain this access for comprehensive testing in the lab consists of the simulation of the respective back-end components and of the required data communication channel via a simulated mobile network.
Figure 3: Test environment for soldered M2M eUICCs
Interoperability testing is possible with the same setup, if real back-end servers instead of their simulations are used.
Unsoldered M2M eUICC
COMPRION provides also the means for testing the remote provisioning functionality of an eUICC chip, that is not yet soldered onto the PCB of an M2M device. The central component beside the simulated or real back-end servers is the COMPRION Network Bridge that connects the back-end directly to the eUICC under test. It eases the work of (e)UICC manufacturers, MNOs, SM-DP and SM-SR providers as they do not need to deal with the complex handling and high investment of a network simulator or the testing limitations in a real network.
Figure: Test environment for unsoldered M2M eUICCs with COMPRION Network Bridge
The RSP M2M Platform allows the use of simulated back-end servers instead of real ones: