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Products & Solutions

Hot Topics

With the rapid increase of new technologies and devices, testing will be more and more in the focus. But what are currently the hot topics and buzzwords in the testing area? For us the following topics are in the spotlight:

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eUICC/Remote Provisioning

The excitement for the embedded SIM technology gathers momentum. eUICCs (embedded Universal Integrated Circuit Cards) are used in machine-to-machine (M2M) communication and aim to replace  removable SIMs in mobile consumer devices. This implies a paradigm shift for the telecoms industry.

Instead of today’s in-house UICC personalization, a remote provisioning mechanism will become the industry standard of the future. As the eUICC ecosystem consists of various industry players and heterogeneous systems, remote updating of an already implemented eUICC is a complex process.

Bringing Know-How & Expertise to eUICC/Remote Provisioning

COMPRION has been offering sophisticated test equipment as well as monitoring solutions for smart cards and terminals for more than a decade. Although testing of the relevant components in the eUICC environment is different from testing pluggable UICCs and the corresponding mobile device interfaces, there is still a wide range of test solutions that can be used in both worlds. We stick the  logo on all test benches in our portfolio that can be employed for testing the eUICC/RSP environment.

Products & Solutions

COMPRION's Approach for Testing Remote Provisioning of eUICCs

Card and Profile Compliance Test Benches for Unsoldered M2M eUICCs

To make sure that M2M devices in the field do not fail, it is very important to test the UICC extensively before soldering. We offer several test benches for our Connectivity Test Center that help you to prove profile interoperability according to SIMalliance specifications as well as GlobalPlatform card compliance.

Figure 1: Test setup for M2M eUICC card compliance testing

The part of the GSMA SGP.11 that focusses on testing SM-DP and SM-SR interfaces (off-card interfaces), is offered in a separate test bench:

Figure 2: Test setup for M2M off-card interface compliance testing

Download Compliance Testing Brochure

 

Interoperability Testing  and Customer-Specific Testing of M2M eUICCs

eUICC soldered into the M2M device
A soldered M2M eUICC can only be accessed indirectly from the back end using the mobile network interface. COMPRION's approach for comprehensive testing in the lab consists of simulating the respective back-end components and the required data communication channel via simulated mobile network.

Figure 3: Test environment for soldered M2M eUICCs 

Interoperability testing is possible with the same setup, if real back-end servers instead of their simulations are used.

Unsoldered M2M eUICC
COMPRION also provides the means for testing the remote provisioning functionality of an eUICC that is not yet soldered onto the PCB of an M2M device. The central component beside the simulated or real back-end server is COMPRION Network Bridge, which connects the back end directly to the eUICC under test. It eases the work of (e)UICC manufacturers, MNOs, SM-DP and SM-SR providers as they do not need to deal with the complex handling and high investment of a network simulator or the testing limitations of a real network.

Figure: Test environment for unsoldered M2M eUICCs with COMPRION Network Bridge

The RSP M2M Platform allows the use of simulated back-end servers instead of real ones:

 

 
Compliance Test Benches for the Consumer Device Architecture

To make sure that consumer devices in the field do not fail, it is very important to test the eUICC extensively before it is soldered. In our Connectivity Test Center, we offer two test benches that help you to prove profile interoperability according to SIMalliance specifications and GSMA SGP.23 compliance.

Figure 1: Consumer device profile compliance test setup for unsoldered eUICCs

Figure 2: Consumer device compliance test setup with transport channel simulation for Wi-Fi
                      (* test bench will be released soon)

We are also planning to release a compliance test bench covering the server tests of the GSMA SGP.23 RSP Test Specification this year.

Download Brochure Compliance Testing

 
Modular Test Environment for Customer-Specific Testing of Consumer Device eUICCs

eUICC Soldered into the Consumer Device
A soldered eUICC can only be accessed indirectly from the back end using the mobile network or the Local Profile Assistant (LPA) via Wi-Fi or Bluetooth. COMPRION's RSP Consumer Devices Platform simulates the respective back-end components and the data communication channels.

Figure 3: Test environment for soldered consumer device eUICCs 

Unsoldered Consumer Device eUICC
COMPRION also provides the means for testing the remote provisioning functionality of an eUICC that is not yet soldered onto the PCB of a consumer device. The central component beside the simulated or real back-end servers is the COMPRION Network Bridge that connects the back end directly to the eUICC under test. It eases the work of (e)UICC manufacturers, MNOs, and SM-DP+  providers as they do not need to deal with the complex handling and high investment of a network simulator or the testing limitations of a real network.

 

Figure 4: Test environment for unsoldered consumer device eUICCs with COMPRION Network Bridge

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