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Products & Solutions

Hot Topics

With the rapid increase of new technologies and devices, testing will be more and more in the focus. But what are currently the hot topics and buzzwords in the testing area? For us the following topics are in the spotlight:

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eUICC/Remote Provisioning

The excitement for the embedded SIM technology gathers momentum. eUICCs (embedded Universal Integrated Circuit Cards) are already in use in machine-to-machine (M2M) communication and aim to replace the removable SIMs in mobile consumer devices. This means also a paradigm shift for the telecoms industry.

Instead of today’s in-house UICC personalization, a remote provisioning mechanism will become the industry standard of the future. As the eUICC ecosystem consists of various industry players and heterogeneous systems, the remote update of an already implemented eUICC is a complex process.

Bringing Know-How and Expertise to eUICC Testing

COMPRION has been offering sophisticated test equipment for smart card and terminal testing as well as monitoring solutions for both contact-based and contactless devices for more than a decade. We have the expertise to provide you with the right solutions. For testing the crucial components, COMPRION is your perfect partner.

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Products & Solutions

COMPRION's Approach for eUICC/Remote Provisioning Testing

Card and Profile Compliance Test Benches for Unsoldered M2M eUICCs

To make sure that M2M devices in the field do not fail, it is very important to test the UICC extensively before it is soldered. On our Card Test Center, we offer two test benches which help you to prove profile interoperability and GlobalPlatform eUICC card compliancy.

 

Figure: Test setup for M2M eUICC card compliance testing

 
Interoperability Testing  and Customer Specific Testing of M2M eUICCs

eUICC soldered into the M2M device
A soldered M2M eUICC can only be accessed indirectly from the backend side using the mobile network interface. COMPRION's approach to gain this access for comprehensive testing in the lab consists of the simulation of the respective backend components and of the required data communication channel via a simulated mobile network.

Figure: Test environment for soldered M2M eUICCs 

Interoperability testing is possible with the same setup, if real backend servers instead of their simulations are used.

Unsoldered M2M eUICC
COMPRION provides also the means for testing the remote provisioning functionality of an eUICC chip, that is not yet soldered onto the PCB of an M2M device. The central component beside the simulated or real backend servers is the COMPRION Network Bridge that connects the backend directly to the eUICC under test. It eases the work of (e)UICC manufacturers, MNOs, SM-DP and SM-SR providers as they do not need to deal with the complex handling and high investment of a network simulator or the testing limitations in a real network.

Figure: Test environment for unsoldered M2M eUICCs with COMPRION Network Bridge

The RSP M2M Test Platform allows the use of simulated backend servers instead of real ones:

Card and Profile Compliance Test Benches for Consumer Device eUICCs

To make sure that consumer devices in the field do not fail, it is very important to test the eUICC extensively before it is soldered. In our Card Test Center we offer two test benches which help you to prove profile interoperability and GlobalPlatform eUICC card compliancy.

Figure 1: Consumer device card compliance test setup for unsoldered eUICCs

Figure 2: Consumer device card compliance test setup for soldered eUICCs
                      with transport channel simulation for Wifi, Bluetooth and the mobile network
                      (* test bench planned)

 
Modular Test Environment for Customer-Specific Testing of Consumer Device eUICCs

eUICC Soldered into the Consumer Device
A soldered eUICC can only be accessed indirectly from the backend side using the mobile network or the Local Profile Assistant (LPA) via WiFi or Bluetooth. COMPRION's RSP Consumer Device Test Platform consists of the simulation of the respective backend components and of the simulated data communication channels.

Figure 3: Test environment for soldered consumer device eUICCs 

Unsoldered Consumer Device eUICC
COMPRION provides also the means for testing the remote provisioning functionality of an eUICC chip, that is not yet soldered onto the PCB of an consumer device. The central component beside the simulated or real backend servers is the COMPRION Network Bridge that connects the backend directly to the eUICC under test. It eases the work of (e)UICC manufacturers, MNOs and SM-DP+  providers as they do not need to deal with the complex handling and high investment of a network simulator or the testing limitations in a real network.

 

Figure 4: Test environment for unsoldered consumer device eUICCs with COMPRION Network Bridge

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