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The intertwining of telecom, banking, and M2M/IoT produces a new degree of complexity. We hope our COMPRION glossary helps you to get a good overview of all the connected terms, technologies, and concepts.
Also called 3FF (3rd form factor) or mini-UICC. Micro-SIM cards have the same thickness and contact arrangements as Mini-SIM, but the length and width are further reduced.
The micro-SIM was developed by the European Telecommunications Standards Institute (ETSI) along with SCP, 3GPP (UTRAN/GERAN), 3GPP2 (CDMA 2000), ARIB, GSMA (GSMA SCaG and GSMNA), GlobalPlatform, Liberty Alliance, and the Open Mobile Alliance (OMA) for the purpose of fitting into devices too small for a mini-SIM.
Invented by NXP Semiconductors. It is the worldwide most used contactless communication protocol within the smart card business. Originally, this protocol was used for ticketing in public transportation. MIFARE is compatible with ISO/IEC 14443 and therefore operating within the proximity distance of 10 cm.
Also called 2FF (2nd form factor) or plug-in SIM. It has the same contact arrangement as the full-size SIM and is normally supplied within a full-size card carrier, attached by a number of linking pieces. This arrangement (defined in ISO/IEC 7810 as ID-1/000) allows such a card to be used in a device requiring a full-size card, or in a device requiring a mini-SIM card after breaking the linking pieces.
Special COMPRION probe for UT3 Platform and Spectro TP whose Analog Probe (APR) devices are pure simulation probes that do not have monitoring capabilities. In turn, the Monitoring Probe is not able to simulate but only to listen in on the signals exchanged between USIM and terminal.
The Monitoring Probe enables watching the voltages on all electrical USIM contacts (VCC, RST, CLK, I/O, SWP, USB) in relation to GND, the current in relation to VCC and the S2 signal of the SWP contact. These signals are available both as logical digital signals and as analog values.
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